
Evelyn N. Wang
Esther and Harold E. Edgerton Assistant Professor of Mechanical EngineeringRoom 3-461B
Massachusetts Institute of Technology
77 Massachusetts Avenue
Cambridge MA 02139-4307
Phone: 617-324-3311
Email: enwang@mit.edu
Web: http://drl.mit.edu
Administrative Contact:
Thea Szatkowski
Room 3-461
Phone: 617-324-2805
Email: theaszat@mit.edu
Education
Ph.D. in Mechanical Engineering, Stanford University. 2006
M.S. in Mechanical Engineering, Stanford University, 2001
B.S. in Mechanical Engineering, M.I.T., 2000
MEMS/NEMS design and sensing, optical diagnostics, systems integration; thermal management for high performance systems; bio-inspired micro-/nano-systems; micro-/nano-scale two-phase transport, heat transfer, and phase-change
Honors and Awards
DARPA Young Faculty Award, 2008
National Defense Science and Engineering Graduate Fellowship
National Science Foundation Graduate Fellowship
Tau Beta Pi Engineering Honor Society
Pi Tau Sigma Mechanical Engineering Honor Society
American Society of Mechanical Engineers
Society of Women Engineers
American Physical Society
American String Teachers Association
Select Publications
2. E.N. Wang, L. Zhang, L. Jiang, J.-M. Koo, J.G. Maveety, E.A. Sanchez, K.E. Goodson, T.W. Kenny. “Micromachined Jets for Liquid Impingement Cooling of VLSI Chips,” Journal of MicroElectroMechanical Systems, 2004, 13(5), p.833-842.
3. E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson, T.W. Kenny. “Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel,” Journal of Heat Transfer, 2004, 128(4), p.497.
4. L. Zhang, E.N. Wang, K.E. Goodson, T.W. Kenny. “Phase Change Phenomena in Silicon Microchannels,” International Journal of Heat and Mass Transfer, 2005, 48(8), p.1572-1582.
5. C.H. Hidrovo, T.A. Kramer, E.N. Wang, S. Vigneron, J.E. Steinbrenner, J.-M. Koo, F.-M. Wang, D.W. Fogg, R.D. Flynn, E.S. Lee, C.-H. Cheng, T.W. Kenny, J.K. Eaton, K.E. Goodson. “Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells,” Heat Transfer Engineering, 2006, 27(4), p.53-63.






