2005, Fellow, International Academy for Production Engineering Research
1996, The Ruth and Joel Spira Award for Distingushed Teaching
1991-1997, Edgerton Career Development Chair
2000-2013, Visiting Scientist, Nanyang Technological University
1984-1989, Vice President Sutek Corporation
International Academy for Production Engineering Research
Society of Petroleum Engineers (SPE)
Society of Naval Architects and Marine Engineers (SNAME)
American Society of Civil Engineers (ASCE)
American Society of Mechanical Engineers (ASME)
Fellow of the AAAS
2011-present, Faculty Director, MISTI MIT-Korea Program
2005-present, Director, Laboratory for Manufacturing and Productivity
Design and Manufacturing II (2.008)
Management in Engineering (2.96, 6.930, 10.806, 16.653)
Management for Engineers (2.961)
Chun, J.H. and Passow, C.H., “Droplet-Based Manufacturing”, CIRP Annals, Vol. 42/1, pp. 235-238, 1993.
Passow, C.H., Chun, J.H. and Ando, T., “Spray Deposition of a Sn - 40 wt. % Pb Alloy with Uniform Droplets”, Metallurgical Transactions, Vol. 24A, pp. 1187-1193, 1993.
Yim, P., Chun, J.H., Ando, T. and Sikka, V.K., “Production and Characterization of Mono-sized Sn-38 Wt.% Pb Alloy Balls”, Int. J. of Powder Metallurgy, Vol. 32, No. 2, pp. 155-164, 1996.
Chen, C.-A., Acquaviva, P.J., Chun, J.H. and Ando, T., “Effects of Droplet Thermal State on Deposit Microstructure in Spray Forming”, Scripta Metallurgica et Materialia, Vol. 34, No. 5, pp. 689-696, 1996.
Hytros, M.H., Jureidini, I., Chun, J.H., Lanza, R.C. and Saka, N., “High-Energy X-ray Computed Tomography of the Progression of the Solidification Front in Pure Aluminum”, Metallurgical and Materials Transactions, Vol. 30A, pp. 1403-1409, 1999.
Chun, J.H., Rocha, J.C. and Oh, J.-H., “Synthesis and Analysis of a Digital Droplet-Size Control System”, CIRP Annals, Vol. 49/1, pp. 143-146, 2000.
Kim, H.-Y. and Chun, J.H., “The Recoiling of Liquid Droplets upon Collision with Solid Surfaces ”, Physics of Fluids, Vol. 13, pp. 643-659, 2001.
Iyer, N., Saka, N. and Chun, J.H., “Contamination of Silicon Surface Due to Contact with Solid Polymers”, IEEE Transactions in Semiconductors, Vol. 14, No. 2, pp., 2001.
Lai, J.-Y., Saka, N. and Chun, J.H., “Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing: I. Contact Mechanics Modeling”, J. of the Electrochemical Society, Vol. 149, No. 1, pp. G31-G40, 2002.
Lai, J.-Y., Saka, N. and Chun, J.H., “Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing: II. Cu Dishing and Oxide Erosion”, J. of the Electrochemical Society, Vol. 149, No. 1, pp. G41-G50, 2002.
Kim, H.-Y., Karahalios, T, Qiu, T. and Chun, J.H., “Microsensor for Impact of Molten Metal Microdrops”, Sensors and Actuators A, Vol. 116. pp. 417-427, 2004.
Han, S., Derksen, J. and Chun, J.H., “Extrusion Spin Coating: An Efficient and Deterministic Photoresist Coating Method in Microlithography”, IEEE Transactions on Semiconductor Manufacturing, Vol. 17, No. 1, pp. 12-21, 2004.
Chan-Park, M., Yang, C., Guo, X., Chen, L.Q., Yoon, S.F., and Chun, J.H., “Fabrication of 3-D Curved Microstructures by Constrained Gas Expansion and Photopolymerization”, Langmuir, 24 (10), pp. 5492-5499, 2008.
Hsiao, W.K., Chun, J.H., and Saka, N., “The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing”, J. of Manufacturing Science and Technology, Vol. 131, pp. 021010-1 -8, 2009.
Eusner, T., Saka, N., Chun, J.H., Armini, S., Moinpour, M. and Fischer, P., “Breaking-In a Pad for Scratch-Free Cu Chemical-Mechanical Polishing”, J. of the Electro Chemical Society, 158(4), 2010.
Kim, S., Saka, N. and Chun, J.H., “Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP”, Accepted for publication in IEEE Transactions on Semiconductor Manufacturing, 2014.
Patent #5,266,098, “Production of Charged Uniformly Sized Metal Droplets”, Chun, J.H. and Passow, C.H., 1993.
Patent #5,509,460,“Solid/Liquid Interface Detection in Continuous Casting Processes by -Ray Attenuation”, Chun, J.H., Lanza, R.C. and Saka, N., 1996.
Patent #5,673,746, “Solid/Liquid Interface Detection in Continuous Casting Processes by -Ray Attenuation”, Chun, J.H., Lanza, R.C. and Saka, N., 1997.