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Jung-Hoon Chun

Contact Info

room 35-233

Massachusetts Institute of Technology

77 Massachusetts Avenue

Cambridge, Masachusetts 02139

Education

  • 1976

    SEOUL NATIONAL UNIVERSITY

    B.Sc.
  • 1980

    UNIVERSITY OF OTTAWA

    M.Sc.
  • 1984

    MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT)

    Ph.D.

Research Interests

  • Manufacturing

Honors + Awards

  • 2005, Fellow, International Academy for Production Engineering Research
  • 1996, The Ruth and Joel Spira Award for Distingushed Teaching
  • 1991-1997, Edgerton Career Development Chair   

Memberships

  • International Academy for Production Engineering Research

Professional Service

  • Society of Petroleum Engineers (SPE)
  • Society of Naval Architects and Marine Engineers (SNAME)
  • American Society of Civil Engineers (ASCE)
  • American Society of Mechanical Engineers (ASME)
  • Fellow of the AAAS

MIT Service

  • 2011-present, Faculty Director, MISTI MIT-Korea Program
  • 2005-present, Director, Laboratory for Manufacturing and Productivity

Teaching

  • Design and Manufacturing II (2.008)
  • Management in Engineering (2.96, 6.930, 10.806, 16.653)
  • Management for Engineers (2.961)

Publications

  • Chun, J.H. and Passow, C.H., “Droplet-Based Manufacturing”, CIRP Annals, Vol. 42/1, pp. 235-238, 1993.
  • Passow, C.H., Chun, J.H. and Ando, T., “Spray Deposition of a Sn - 40 wt. % Pb Alloy with Uniform Droplets”, Metallurgical Transactions, Vol. 24A, pp. 1187-1193, 1993.
  • Yim, P., Chun, J.H., Ando, T. and Sikka, V.K., “Production and Characterization of Mono-sized Sn-38 Wt.% Pb Alloy Balls”, Int. J. of Powder Metallurgy, Vol. 32, No. 2, pp. 155-164, 1996.
  • Chen, C.-A., Acquaviva, P.J., Chun, J.H. and Ando, T., “Effects of Droplet Thermal State on Deposit Microstructure in Spray Forming”, Scripta Metallurgica et Materialia, Vol. 34, No. 5, pp. 689-696, 1996.
  • Hytros, M.H., Jureidini, I., Chun, J.H., Lanza, R.C. and Saka, N., “High-Energy X-ray Computed Tomography of the Progression of the Solidification Front in Pure Aluminum”, Metallurgical and Materials Transactions, Vol. 30A, pp. 1403-1409, 1999.
  • Chun, J.H., Rocha, J.C. and Oh, J.-H., “Synthesis and Analysis of a Digital Droplet-Size Control System”, CIRP Annals, Vol. 49/1, pp. 143-146, 2000.
  • Kim, H.-Y. and Chun, J.H., “The Recoiling of Liquid Droplets upon Collision with Solid Surfaces ”, Physics of Fluids, Vol. 13, pp. 643-659, 2001.
  • Iyer, N., Saka, N. and Chun, J.H., “Contamination of Silicon Surface Due to Contact with Solid Polymers”, IEEE Transactions in Semiconductors, Vol. 14, No. 2, pp., 2001.
  • Lai, J.-Y., Saka, N. and Chun, J.H., “Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing: I. Contact Mechanics Modeling”, J. of the Electrochemical Society, Vol. 149, No. 1, pp. G31-G40, 2002.
  • Lai, J.-Y., Saka, N. and Chun, J.H., “Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing: II. Cu Dishing and Oxide Erosion”, J. of the Electrochemical Society, Vol. 149, No. 1, pp. G41-G50, 2002.
  • Kim, H.-Y., Karahalios, T, Qiu, T. and Chun, J.H., “Microsensor for Impact of Molten Metal Microdrops”, Sensors and Actuators A, Vol. 116. pp. 417-427, 2004.
  • Han, S., Derksen, J. and Chun, J.H., “Extrusion Spin Coating: An Efficient and Deterministic Photoresist Coating Method in Microlithography”, IEEE Transactions on Semiconductor Manufacturing, Vol. 17, No. 1, pp. 12-21, 2004.
  • Chan-Park, M., Yang, C., Guo, X., Chen, L.Q., Yoon, S.F., and Chun, J.H., “Fabrication of 3-D Curved Microstructures by Constrained Gas Expansion and Photopolymerization”, Langmuir, 24 (10), pp. 5492-5499, 2008.
  • Hsiao, W.K., Chun, J.H., and Saka, N., “The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing”, J. of Manufacturing Science and Technology, Vol. 131, pp. 021010-1 -8, 2009.
  • Eusner, T., Saka, N., Chun, J.H., Armini, S., Moinpour, M. and Fischer, P., “Breaking-In a Pad for Scratch-Free Cu Chemical-Mechanical Polishing”, J. of the Electro Chemical Society, 158(4), 2010.
  • Kim, S., Saka, N. and Chun, J.H., “Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP”, Accepted for publication in IEEE Transactions on Semiconductor Manufacturing, 2014.

Patents

  • Patent #5,266,098, “Production of Charged Uniformly Sized Metal Droplets”, Chun, J.H. and Passow, C.H., 1993.
  • Patent #5,509,460,“Solid/Liquid Interface Detection in Continuous Casting Processes by -Ray Attenuation”, Chun, J.H., Lanza, R.C. and Saka, N., 1996.
  • Patent #5,673,746, “Solid/Liquid Interface Detection in Continuous Casting Processes by -Ray Attenuation”, Chun, J.H., Lanza, R.C. and Saka, N., 1997.
  • Patent #6,191,053, “High Efficiency Photoresist Coating”,  Chun, J.H., Derksen, J.S. and Han, S., 2001.
  • Patent #7,030,039, “Method of Uniformly Coating a Substrate”, Gurer, E., Zhong, T. Lewellen, J., Lee, E.C., Mandal, R.P., Grambow, J.C., Bettes, T.C., Sauer, D.R., Ward, E.R., Chun, J.H. and Han, S., 2006.